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Microvias : for low-cost, high-density interconnects /

Lau, John H.

Microvias : for low-cost, high-density interconnects / John H. Lau - New York : 2001 - 565p.: 23cm

ISBN: 0071363270 (hbk)

Dewey Class. No.: 621.381046 LAU-M 2001 9571

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